top of page
截屏2023-11-27 21.41_edited.jpg

The 21st IEEE International School and Symposium on 
Medical Devices and Biosensors 

in conjunction with 
The 14th Internati
onal Symposium on Biomedical and Health Engineering

MDBS-BHE’ 2023
​Hybrid Mode, HONG KONG, Dec 18-20, 2023

About MDBS-BHE’ 2023

The 21st IEEE International School and Symposium on Medical Devices and Biosensors (MDBS'2023) will be held in hybrid mode in Hong Kong on 18-20 December 2023 in conjunction with the 14th International Symposium on Biomedical and Health Engineering (BHE'2023).

The distinguished scientists and faculty members from the world-leading universities in different countries are invited to give short-courses, tutorials, and talks covering state-of-the-art technologies in the areas of health engineering especially biomedical optics, biosensors and wearable medical devices, medical imaging, robotics and Al with applications in the prediction and control of chronic diseases such as cardiovascular diseases (CVD), diabetes and cancers. The main theme of MDBS-BHE'2023 is "Emerging Bio-optical and Biosensing Technologies for Future Health".


MDBS-BHE'2023 Main Topics Include (but not limited to):


  • Optical, electrical and mechanical medical devices/systems

  • Biosensing, molecular and biomarker detection

  • Wearable and flexible sensing, connected health, telemedicine

  • High-resolution, fast spatiotemporal imaging, microscope

  • Biomaterials, tissue engineering

  • AI in biomedical and healthcare applications

You are cordially invited to contribute papers to MDBS-BHE'2023. Selective papers will be presented as 10-minute short talks (on-site or online) and sent for peer-review for the Connected Health and Telemedicine (CHATmed), an international open-access journal with multiple languages for titles and abstracts. The publication fee will be waived for accepted papers. Outstanding papers will be selected for one First Prize (US$ 500) and two Second Prize (US$ 250) EMBS Best Student Paper Awards at the symposium.


Important Dates/Deadlines:


  • Registration fee will be waived this year

  • Short abstract, and/or 1-4-page paper submissions: 16 October 2023 (extended to 30 November 2023. )

  • Notification of selected papers: 17 November 2023 (extended to 7 December 2023. )

  • Complementary registration deadline: 17 November 2023 (Submission deadline is extended to 1 December 2023. Due to limited space, participants are highly encouraged to register early.)


Organized by Department of Biomedical Engineering, City University of Hong Kong

Sponsored by IEEE Engineering in Medicine & Biology Society (EMBS)


LT-4, 4/F,Yeung Kin Man Academic Building, City University of Hong Kong, 83 Tat Chee Ave, Kowloon Tong, Hong Kong SAR


bottom of page